• No Items SPEC
    1 Trace Width/Space 35μm /35μm
    2 Trace Width Tolerance ±10%
    3 Distance between Pad and Conductor 0.075mm
    4 Distance between Board Edge and Conductor 0.15mm
    5 Min. Pad Size 0.3*0.3mm
    6 PTH Pad Size 0.25mm
    7 Min. PTH Aperture 0.05mm
    8 Registration of Silk-Screen ±0.075mm
    9 Tolerance of External Dimension ±0.05mm
    10 Tolerance of Aperture ±0.015mm
    11 Registration of Hole ±0.025mm
    12 Thickness of Ni Plating 1μm-5μm
    13 Thickness of Au Plating 0.05μm-0.2μm 
    14 Maximum Layer 8 Layers



    項目 量產能力
    Chip器件 可加工最小尺寸電阻、電容電感 0201
    SMT加工直通率 99.95%
    連接器 可加工最小Pitch 連接器 0.4mm
    SMT加工直通率 99.80%
    BGA 可加工最小Pitch BGA器件 0.4mm
    SMT加工直通率 99.80%
    QFN 可加工最小Pitch QFN器件 0.4mm
    SMT加工直通率 99.80%
    LED LED燈貼裝角度精度 ±1°
    SMT加工直通率 99.90%
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